Personal information
China
Activities
Employment (1)
2014-09-01
to
present
|
Research Assistant
(Department of Computer and Control Engineering)
Employment
Source:
Boyang Du
Education and qualifications (3)
2013-03
to
present
|
PhD
(Department of Control and Computer Engineering)
Education
Source:
Boyang Du
2010-09
to
2012-11
|
Master
(Department of Control and Computer Engineering)
Education
Source:
Boyang Du
2006-09
to
2010-07
|
Bachelor
Education
Source:
Boyang Du
Works (17)
IEEE Systems Journal
2022-06
|
Journal article
Contributors:
Boyang Du;
Sarah Azimi;
Annarita Moramarco;
Davide Sabena;
Filippo Parisi;
Luca Sterpone
Source:
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Crossref
IEEE Transactions on Nuclear Science
2020-09
|
Journal article
Contributors:
L. Sterpone;
F. Luoni;
S. Azimi;
B. Du
Source:
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Crossref
Integration
2019-07
|
Journal article
Contributors:
S. Azimi;
B. Du;
L. Sterpone;
D.M. Codinachs;
R. Grimoldi;
L. Cattaneo
Source:
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Crossref
IEEE Transactions on Nuclear Science
2019-07
|
Journal article
Contributors:
Boyang Du;
Luca Sterpone;
Sarah Azimi;
David Merodio Codinachs;
Veronique Ferlet-Cavrois;
Cesar Boatella Polo;
Ruben Garcia Alia;
Maria Kastriotou;
Pablo Fernandez-Martinez
Source:
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Crossref
Microelectronics Reliability
2017-09
|
Journal article
Contributors:
Qiutao Zhang;
Sarah Azimi;
Germano La Vaccara;
Luca Sterpone;
Boyang Du
Source:
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Crossref
Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics)
2016
|
Book
EID:
2-s2.0-84962440387
Contributors:
Azimi, S.;
Du, B.;
Sterpone, L.
Source:
Boyang Du
via
Scopus - Elsevier
Formal Proceedings of the 2016 IEEE 19th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2016
2016
|
Conference paper
EID:
2-s2.0-84978499146
Contributors:
Du, B.;
Sanchez, E.;
Reorda, M.S.;
Acle, J.P.;
Tsertov, A.
Source:
Boyang Du
via
Scopus - Elsevier
LATS 2016 - 17th IEEE Latin-American Test Symposium
2016
|
Conference paper
EID:
2-s2.0-84978543422
Contributors:
Chielle, E.;
Du, B.;
Kastensmidt, F.L.;
Cuenca-Asensi, S.;
Sterpone, L.;
Reorda, M.S.
Source:
Boyang Du
via
Scopus - Elsevier
IEEE Transactions on Computers
2016-06-01
|
Journal article
Contributors:
Boyang Du;
Matteo Sonza Reorda;
Luca Sterpone;
Luis Parra;
Marta Portela-García;
Almudena Lindoso;
Luis Entrena
Source:
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Crossref
grade
Preferred source
(of
2)
2015 11th Conference on Ph.D. Research in Microelectronics and Electronics, PRIME 2015
2015
|
Conference paper
EID:
2-s2.0-84946845828
Contributors:
Du, B.;
Desogus, M.;
Sterpone, L.
Source:
Boyang Du
via
Scopus - Elsevier
Microelectronics Reliability
2015
|
Journal article
EID:
2-s2.0-84943396189
Contributors:
Sterpone, L.;
Du, B.;
Azimi, S.
Source:
Boyang Du
via
Scopus - Elsevier
Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics)
2015
|
Book
EID:
2-s2.0-84926677047
Contributors:
Sterpone, L.;
Du, B.
Source:
Boyang Du
via
Scopus - Elsevier
IEEE Transactions on Nuclear Science
2014
|
Journal article
EID:
2-s2.0-84919924149
Contributors:
Parra, L.;
Lindoso, A.;
Portela-Garcia, M.;
Entrena, L.;
Du, B.;
Reorda, M.S.;
Sterpone, L.
Source:
Boyang Du
via
Scopus - Elsevier
Proceedings of the 2014 IEEE 20th International On-Line Testing Symposium, IOLTS 2014
2014
|
Conference paper
EID:
2-s2.0-84906653205
Contributors:
Du, B.;
Reorda, M.S.;
Sterpone, L.;
Parra, L.;
Portela-Garcia, M.;
Lindoso, A.;
Entrena, L.
Source:
Boyang Du
via
Scopus - Elsevier
Proceedings - 2014 19th IEEE European Test Symposium, ETS 2014
2014
|
Conference paper
EID:
2-s2.0-84904489016
Contributors:
Sterpone, L.;
Du, B.
Source:
Boyang Du
via
Scopus - Elsevier
Proceedings - International Workshop on Microprocessor Test and Verification
2014
|
Conference paper
EID:
2-s2.0-84908460887
Contributors:
Bernardi, P.;
Cantoro, R.;
Ciganda, L.;
Du, B.;
Sanchez, E.;
Reorda, M.S.;
Grosso, M.;
Ballan, O.
Source:
Boyang Du
via
Scopus - Elsevier
Proceedings of the 2013 IEEE 19th International On-Line Testing Symposium, IOLTS 2013
2013
|
Conference paper
EID:
2-s2.0-84885206200
Contributors:
Du, B.;
Reorda, M.S.;
Sterpone, L.;
Parra, L.;
Portela-Garcia, M.;
Lindoso, A.;
Entrena, L.
Source:
Boyang Du
via
Scopus - Elsevier