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Technische Hochschule Rosenheim: Rosenheim, DE

2010-02-01 to present | Professor (Power Electronics and EMC Laboratory)
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Norbert Seliger

Works (49)

Reconfigurable Polygonal Planar Inductor with Bistable Snapping Mechanism

IEEE Open Conference of Electrical, Electronic and Information Sciences (eStream)
2024 | Conference paper
Contributors: Seliger, N.
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A Differential Relaxation Half-Bridge Oscillator for Inductive Power Transfer

2023 | Journal article
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A Planar Magneto-Inductive Device with Modulated Mutual Inductance for Wireless Power Transmission

IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications (APWC)
2023 | Conference paper
Contributors: Seliger, N.; Honsa, J.
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Progressive Expansion Sampling of Quasi-Static Magnetic Fields in Unconfined Regions

IEEE Transactions on Components, Packaging and Manufacturing Technology
2023-10 | Journal article
Contributors: Norbert Seliger; Georg Faltlhauser
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A Differential Relaxation Oscillator for Inductive Power Transfer

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Active Expansion Sampling of Magnetic Near-Fields in Unbounded Regions

17TH IEEE WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI)
2022 | Journal article
Contributors: Seliger, Norbert; Faltlhauser, Georg
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Self-Oscillating Capacitive Power Transfer with Multiple Receiver Capability and Coupling Path Adaption

European Conference on Power Electronics and Applications
2022 | Conference paper
Contributors: Seliger, Norbert
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Design of a Half-Bridge Converter for Self-Adapting Capacitive Wireless Power Transfer

IEEE Conference on Energy Conversion
2021 | Conference paper
Contributors: Seliger, Norbert
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Design of a Low Multi-Loop Inductance Three Level Neutral Point Clamped Inverter with GaN HEMTs

IEEE Energy Conversion Congress and Exposition (ECCE)
2020 | Conference paper
Contributors: Dechant, Eduard; Seliger, Norbert; Kennel, Ralph
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A study of dielectric breakdown of a half-bridge switching cell with substrate integrated 650V GaN dies

IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP)
2019 | Conference paper
Contributors: Dechant, Eduard; Seliger, Norbert; Kennel, Ralph
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Power cycling and temperature endurance test of a GaN switching cell with substrate integrated chips

Microelectronics Reliability
2019 | Journal article
Contributors: Dechant, E.; Seliger, N.; Kennel, R.
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Ring resonator based signal and power transfer at UHF frequencies

6TH INTERNATIONAL EURASIP WORKSHOP ON RFID TECHNOLOGY (EURFID)
2018 | Journal article
Contributors: Stoettner, Julia; Seliger, Norbert
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FPGA-based high dynamic servo drive control with a 200 kHz Gallium Nitride inverter

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FPGA-based High Dynamic Servo Drive Control with a 200 kHz Gallium Nitride Inverter

European Conference on Power Electronics and Applications
2017 | Conference paper
Contributors: Stubenrauch, Franz; Wittmann, Josef; Kiermayer, Alexander; Seliger, Norbert; Hagl, Rainer; Schmitt-Landsiedel, Doris; Kennel, Ralph
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A 13.56MHz class E power amplifier for inductively coupled DC supply with 95% Power Added Efficiency (PAE)

6TH INTERNATIONAL EURASIP WORKSHOP ON RFID TECHNOLOGY (EURFID)
2015 | Journal article
Contributors: Stubenrauch, F.; Seliger, N.; Schustek, M.; Lebedev, A.; Schmitt-Landsiedel, D.
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Dual Rosenheim Model: Mechatronics Degree Program at Rosenheim University of Applied Sciences Why Mechatronics?

Atp Edition
2010 | Journal article
Contributors: Versen, M.; Schinagl, S.; Seliger, N.; Wagner, M.; Ploetz, F.
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Reliability of high temperature inverters for HEV

POWER CONVERSION CONFERENCE - NAGOYA, VOLS 1-3
2007 | Journal article
Contributors: Renken, F.; Ehbauer, G.; Karrer, V.; Knorr, R.; Ramminger, S.; Seliger, N.; Wolfgang, E.
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Design and evaluation of an automotive integrated system module

IEEE Industry Applications Society Annual Meeting
2005 | Conference paper
Contributors: Gerber, M; Ferreira, JA; Seliger, N; Hofsajer, IW
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High density packaging of the passive components in an automotive DC/DC converter

IEEE Transactions on Power Electronics
2005 | Journal article
Contributors: Gerber, M; Ferreira, JA; Hofsajer, IW; Seliger, N
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Integral 3-D thermal, electrical and mechanical design of an automotive DC/DC converter

IEEE Transactions on Power Electronics
2005 | Journal article
Contributors: Gerber, M; Ferreira, JA; Seliger, N; Hofsajer, IW
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A high-density heat-sink-mounted inductor for automotive applications

IEEE Transactions on Industry Applications
2004 | Journal article
Contributors: Gerber, M; Abraham, JA; Hofsajer, IW; Seliger, N
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A new integrated packaging technology for high-power automotive electronics

South African Journal of Science
2004 | Journal article
Contributors: Hofsajer, IW; Gerber, M; Ferreira, JA; Seliger, N
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An improved 3D integrated DC/DC converter for high temperature environments

IEEE Power Electronics Specialists Conference
2004 | Conference paper
Contributors: Gerber, M; Ferreira, JA; Hofsajer, IW; Seliger, N
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EMC-optimised design of a converter power stage by reduction of surface currents

IEEE Power Electronics Specialists Conference
2004 | Conference paper
Contributors: Rohrich, A; Hirsch, H; Seliger, N
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Interleaving optimization in synchronous rectified DC/DC converters

IEEE Power Electronics Specialists Conference
2004 | Conference paper
Contributors: Gerber, M; Ferreira, JA; Hofsajer, IW; Seliger, N
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High temperature reliability on automotive power modules verified by power cycling tests up to 150 degrees C

Microelectronics Reliability
2003 | Journal article
Contributors: Coquery, G; Lefranc, G; Licht, T; Lallemand, R; Seliger, N; Berg, H
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High temperature, high power density packaging for automotive applications

IEEE Power Electronics Specialists Conference
2003 | Conference paper
Contributors: Gerber, M; Ferreira, JA; Hofsajer, IW; Seliger, N
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Hot-spot measurements and analysis of electro-thermal effects in low-voltage power-MOSFET's

Microelectronics Reliability
2003 | Journal article
Contributors: Castellazzi, A; Kartal, V; Kraus, R; Seliger, N; Honsberg-Riedl, M; Schmitt-Landsiedel, D
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Reliability aspects of semiconductor devices in high temperature applications

Microelectronics Reliability
2003 | Journal article
Contributors: Kanert, W; Dettmer, H; Plikat, B; Seliger, N
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A very high density, heatsink mounted inductor for automotive applications

IEEE Industry Applications Society Annual Meeting
2002 | Conference paper
Contributors: Gerber, M; Ferreira, JA; Hofsajer, IW; Seliger, N
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A volumetric optimization of a low-pass filter

IEEE Transactions on Industry Applications
2002 | Journal article
Contributors: Gerber, M; Ferreira, JA; Hofsajer, IW; Seliger, N
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High density packaging of the passive components in an automotive DC/DC converter

IEEE Power Electronics Specialists Conference
2002 | Conference paper
Contributors: Gerber, M; Ferreira, JA; Hofsajer, IW; Seliger, N
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Reliability analysis of power MOSFET's with the help of compact models and circuit simulation

Microelectronics Reliability
2002 | Journal article
Contributors: Castellazzi, A; Kraus, R; Seliger, N; Schmitt-Landsiedel, D
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Reliable power electronics for automotive applications

Microelectronics Reliability
2002 | Journal article
Contributors: Seliger, N; Wolfgang, E; Lefranc, G; Berg, H; Licht, T
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A volumetric optimization of a low pass filter

IEEE Industry Applications Society Annual Meeting
2001 | Conference paper
Contributors: Gerber, M; Ferreira, JA; Hofsajer, IW; Seliger, N
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A study of heel crack failures in wire bonds under mechanical cycling

Micro Materials, Proceedings
2000 | Journal article
Contributors: Seliger, N; Ramminger, S; Franke, T; Wachutka, G
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Interferometric temperature mapping during ESD stress and failure analysis of smart power technology ESD protection devices

Journal of Electrostatics
2000 | Journal article
Contributors: Furbock, C; Pogany, D; Litzenberger, M; Gornik, E; Seliger, N; Gossner, H; Muller-Lynch, T; Stecher, M; Werner, W
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Reliability model for Al wire bonds subjected to heel crack failures

Microelectronics Reliability
2000 | Journal article
Contributors: Ramminger, S; Seliger, N; Wachutka, G
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Damage analysis in smart-power technology electrostatic discharge (ESD) protection devices

Microelectronics Reliability
1999 | Journal article
Contributors: Pogany, D; Seliger, N; Litzenberger, M; Gossner, H; Stecher, M; Muller-Lynch, T; Werner, W; Gornik, E
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Interferometric temperature mapping during ESD stress and failure analysis of Smart Power technology ESD protection devices

ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM PROCEEDINGS
1999 | Conference paper
Contributors: Furbock, C; Pogany, D; Litzenberger, M; Gornik, E; Seliger, N; Gossner, H; Muller-Lynch, T; Stecher, M; Werner, W
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Laser interferometric method for ns-time scale thermal mapping of Smart Power ESD protection devices during ESD stress

Microelectronics Reliability
1999 | Journal article
Contributors: Furbock, C; Litzenberger, M; Pogany, D; Gornik, E; Seliger, N; Muller-Lynch, T; Stecher, M; Gossner, H; Werner, W
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Analysis of the temperature evolution from the time resolved thermooptical interferometric measurements with few Fabry-Perot peaks

Journal of Applied Physics
1998 | Journal article
Contributors: Pogany, D; Seliger, N; Gornik, E; Stoisiek, M; Lalinsky, T
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Backside laserprober characterization of thermal effects during high current stress in Smart Power ESD protection devices

International Electron Devices Meeting
1998 | Conference paper
Contributors: Furbock, C; Seliger, N; Pogany, D; Litzenberger, M; Gornik, E; Stecher, M; Gossner, H; Werner, W
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Internal characterization of IGBTs using the backside laser probing technique - Interpretation of measurement by numerical simulation

ISPSD - PROCEEDINGS OF THE INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS
1998 | Journal article
Contributors: Thalhammer, R; Furbock, C; Seliger, N; Deboy, G; Gornik, E; Wachutka, G
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Study of thermal effects in GaAs micromachined power sensor microsystems by an optical interferometer technique

Microelectronics Journal
1998 | Journal article
Contributors: Pogany, D; Seliger, N; Lalinsky, T; Kuzmik, J; Habas, P; Hrkut, P; Gornik, E
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Thermal simulation and characterization of GaAs micromachined power-sensor microsystems

Sensors and Actuators A: Physical
1998 | Journal article
Contributors: Burian, E; Pogany, D; Lalinsky, T; Seliger, N; Gornik, E
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A laser beam method for evaluation of thermal time constant in smart power devices

Microelectronics Reliability
1997 | Journal article
Contributors: Seliger, N; Pogany, D; Furbock, C; Habas, P; Gornik, E; Stoisiek, M
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Time-resolved analysis of self-heating in power VDMOSFETs using backside laserprobing

Solid-State Electronics
1997 | Journal article
Contributors: Seliger, N; Habas, P; Pogany, D; Gornik, E
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A study of backside laser-probe signals in MOSFETs

Microelectronic Engineering
1996 | Journal article
Contributors: Seliger, N; Habas, P; Gornik, E
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Peer review (50 reviews for 2 publications/grants)

Review activity for IEEE transactions on power electronics. (41)
Review activity for Microelectronics and reliability. (9)