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A Novel Hybrid Delay Unit Based on Dummy TSVs for 3-D On-Chip Memory

IEEE Transactions on Very Large Scale Integration (VLSI) Systems
2018-07 | Journal article
DOI: 10.1109/TVLSI.2018.2809961
Contributors: Xiaowei Chen; Seyed Alireza Pourbakhsh; Jingyan Fu; Na Gong; Jinhui Wang
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