Personal information
Biography
Yanwei Dai received Ph.D. degree in Mechanics from Tsinghua University, Beijing, China, in 2018. After that, he joined Beijing University of Technology, China, where he was promoted successively as a Postdoctoral Research Fellow, Lecturer, and Associate Professor. Since 2024, he has been promoted as a Full Professor. He has authored and co-authored more than 100 peer-reviewed journal and conference papers including more than 70 peer-reviewed journal articles. His current research interests include the areas of fracture mechanics at elevated temperature, mechanical evaluation and testing for materials and structures in electronics, and reliability of electronics packaging. He has been the editorial board member of three academic journals. He is also a session member of the IEEE ICEPT technical committee. Dr. Dai has been the principal investigator of several scientific research projects granted by the National Natural Science Foundation of China, the Beijing Natural Science Foundation, and China Postdoctoral Science Foundation., etc. Dr. Dai also closely works with the industrial fields on electronics packaging technology and reliability.