Personal information

Biography

Yanwei Dai received Ph.D. degree in Mechanics from Tsinghua University, Beijing, China, in 2018. After that, he joined Beijing University of Technology, China, where he was promoted successively as a Postdoctoral Research Fellow, Lecturer, and Associate Professor. Since 2024, he has been promoted as a Full Professor. He has authored and co-authored more than 100 peer-reviewed journal and conference papers including more than 70 peer-reviewed journal articles. His current research interests include the areas of fracture mechanics at elevated temperature, mechanical evaluation and testing for materials and structures in electronics, and reliability of electronics packaging. He has been the editorial board member of three academic journals. He is also a session member of the IEEE ICEPT technical committee. Dr. Dai has been the principal investigator of several scientific research projects granted by the National Natural Science Foundation of China, the Beijing Natural Science Foundation, and China Postdoctoral Science Foundation., etc. Dr. Dai also closely works with the industrial fields on electronics packaging technology and reliability.

Activities

Employment (2)

Beijing University of Technology: Beijing, CN

2024-09-19 to present | Full Professor (Department of Mechanics)
Employment
Source: Self-asserted source
Yanwei Dai

Beijing University of Technology: Beijing, CN

2020-07-01 to 2024-09-18 | Associate Professor (Faculty of Materials and Manufacturing)
Employment
Source: Self-asserted source
Yanwei Dai

Peer review (61 reviews for 14 publications/grants)

Review activity for Acta Mechanica Solida Sinica. (1)
Review activity for Engineering fracture mechanics. (7)
Review activity for Engineering structures. (3)
Review activity for Heliyon. (1)
Review activity for International journal of dynamics and control. (1)
Review activity for International journal of fatigue. (1)
Review activity for International journal of pressure vessels and piping. (3)
Review activity for Journal of Engineering Mathematics (1)
Review activity for Materials and design. (2)
Review activity for Materials science & engineering. (3)
Review activity for Microelectronics and reliability. (30)
Review activity for Optics and lasers in engineering. (4)
Review activity for Structures. (2)
Review activity for Theoretical and applied fracture mechanics. (2)