Personal information

India

Activities

Employment (2)

Qualcomm India Pvt Ltd: Bangalore, Karnataka, IN

2015-10-16 to present
Employment
Source: Self-asserted source
Vinay Kumar Chapala

Ikanos Communications: Bangalore, Karnataka, IN

2013-07-15 to 2015-10-15
Employment
Source: Self-asserted source
Vinay Kumar Chapala

Education and qualifications (2)

Birla Institute of Technology and Science: Pilani, Rajasthan, IN

2020-10-15 to present | PhD. (Electrical And Electronics Engineering)
Education
Source: Self-asserted source
Vinay Kumar Chapala

Indian Institute of Technology Delhi: New Delhi, Delhi, IN

2011-07-15 to 2013-06-15 | Master Of Technology (Electrical And Electronics Engineering)
Education
Source: Self-asserted source
Vinay Kumar Chapala

Works (6)

Sum and Product of Multivariate Fox-H Functions: Exact Analysis for RIS-Assisted System Over Rician Fading With Imperfect CSI

IEEE Open Journal of the Communications Society
2024 | Journal article
Contributors: Vinay Kumar Chapala; S. M. Zafaruddin
Source: check_circle
Crossref

Multiple RIS-Assisted Mixed FSO-RF Transmission Over Generalized Fading Channels

IEEE Systems Journal
2023 | Journal article
Contributors: Vinay Kumar Chapala; Syed Mohammad Zafaruddin
Source: check_circle
Crossref

Intelligent Connectivity Through RIS-Assisted Wireless Communication: Exact Performance Analysis With Phase Errors and Mobility

IEEE Transactions on Intelligent Vehicles
2023-10 | Journal article
Contributors: Vinay Kumar Chapala; S. M. Zafaruddin
Source: check_circle
Crossref

Unified Performance Analysis of Reconfigurable Intelligent Surface Empowered Free-Space Optical Communications

IEEE Transactions on Communications
2022-04 | Journal article
Contributors: Vinay Kumar Chapala; S. M. Zafaruddin
Source: check_circle
Crossref

Exact Analysis of RIS-Aided THz Wireless Systems Over α-μ Fading With Pointing Errors

IEEE Communications Letters
2021-11 | Journal article
Contributors: Vinay Kumar Chapala; S. M. Zafaruddin
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Crossref

Dual Sensor Impulse Noise Cancellation for Downstream DSL Systems

IEEE Transactions on Communications
2021-05 | Journal article
Contributors: S. M. Zafaruddin; Vinay Kumar Chapala; Surendra Prasad
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Crossref