Personal information
Delta-Sigma, SAR, ADC, Test, Floating-Point, Taylor-Series, Algorithm
Japan
Activities
Education and qualifications (2)
2019-10-01
to
present
|
Ph.D Candidates
(Division of Electronics and Informatics)
Education
Source:
Jianglin Wei
2017-10-01
to
2019-09-30
|
M.S.
(Division of Electronics and Informatics)
Education
Source:
Jianglin Wei
Works (9)
IEEE Transactions on Circuits and Systems II: Express Briefs
2021
|
Journal article
EID:
2-s2.0-85101819752
Contributors:
Wei, J.;
Kuwana, A.;
Kobayashi, H.;
Kubo, K.;
Tanaka, Y.
Source:
Jianglin Wei
via
Scopus - Elsevier
grade
Preferred source
(of
2)
IEEJ Transactions on Electronics, Information and Systems
2021
|
Journal article
EID:
2-s2.0-85098708777
Contributors:
Kobayashi, H.;
Kuwana, A.;
Wei, J.;
Tsukiji, N.;
Zhao, Y.
Source:
Jianglin Wei
via
Scopus - Elsevier
2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings
2020
|
Conference paper
EID:
2-s2.0-85099189391
Contributors:
Kobayashi, H.;
Kuwana, A.;
Wei, J.;
Zhao, Y.;
Katayama, S.;
Tri, T.M.;
Hirai, M.;
Nakatani, T.;
Hatayama, K.;
Sato, K.
et al.
Source:
Jianglin Wei
via
Scopus - Elsevier
Proceedings of 2020 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2020
2020
|
Conference paper
EID:
2-s2.0-85099532252
Contributors:
Wei, J.;
Kuwana, A.;
Kobayashi, H.;
Kubo, K.
Source:
Jianglin Wei
via
Scopus - Elsevier
Proceedings of the Asian Test Symposium
2020
|
Conference paper
EID:
2-s2.0-85099122731
Contributors:
Ogihara, G.;
Nakatani, T.;
Hatta, A.;
Sato, K.;
Ishida, T.;
Okamoto, T.;
Ichikawa, T.;
Kuwana, A.;
Aoki, R.;
Katayama, S.
et al.
Source:
Jianglin Wei
via
Scopus - Elsevier
Proceedings of International Conference on ASIC
2019
|
Conference paper
EID:
2-s2.0-85082576894
Contributors:
Wei, J.-L.;
Ishida, T.;
Okamoto, T.;
Ichikawa, T.;
Kushita, N.;
Arai, T.;
Sha, L.;
Kuwana, A.;
Kobayashi, H.;
Nakatani, T.
et al.
Source:
Jianglin Wei
via
Scopus - Elsevier
Proceedings of the IEEE VLSI Test Symposium
2019
|
Conference paper
EID:
2-s2.0-85069211701
Contributors:
Asada, Y.;
Shimizu, T.;
Gendai, Y.;
Sato, K.;
Ishida, T.;
Okamoto, T.;
Ichikawa, T.;
Wei, J.-L.;
Kushita, N.;
Arai, H.
et al.
Source:
Jianglin Wei
via
Scopus - Elsevier
2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2018 - Proceedings
2018
|
Conference paper
EID:
2-s2.0-85060300098
Contributors:
Wei, J.-L.;
Kushita, N.;
Kobayashi, H.
Source:
Jianglin Wei
via
Scopus - Elsevier
2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2018 - Proceedings
2018
|
Conference paper
EID:
2-s2.0-85060311056
Contributors:
Kobayashi, H.;
Wei, J.-L.;
Murakami, M.;
Kojima, J.-Y.;
Kushita, N.;
Du, Y.;
Wang, J.
Source:
Jianglin Wei
via
Scopus - Elsevier