Personal information

electronics, multi-core processors, thermal simulation, novel cooling methods
Poland

Activities

Employment (2)

Lodz University of Technology: Łódź, PL

2009 to present | Assistant professor/researcher
Employment
Source: Self-asserted source
Piotr Zajac

Laboratoire d'analyse et d'architecture des systèmes: Toulouse, Midi-Pyrénées, FR

2008-07 to 2009-02
Employment
Source: Self-asserted source
Piotr Zajac

Education and qualifications (2)

INSA Toulouse: Toulouse, Midi-Pyrénées, FR

2006 to 2008 | Ph. D.
Education
Source: Self-asserted source
Piotr Zajac

Lodz University of Technology: Łódź, PL

2000 to 2005 | M. Sc.
Education
Source: Self-asserted source
Piotr Zajac

Works (50 of 93)

Items per page:
Page 1 of 2

Self-noise reduction in a FOG-based rotational seismometer confirmed by Allan variance analysis

Opto-Electronics Review
2024-11-30 | Journal article
Contributors: Łukasz Starzak; Rafał Kiełbik; Michał Szermer; Piotr Zając; Piotr Amrozik; Cezary Maj; Bartosz Pękosławski; Grzegorz Jabłoński; Wojciech Tylman; Anna T. Kurzych et al.
Source: check_circle
Crossref

An Experimental Investigation of Noise Sources’ Contribution in the Multi-Chip Module Open-Loop Comb-Drive Capacitive MEMS Accelerometer

Electronics
2024-07-02 | Journal article
Contributors: Mariusz Jankowski; Michał Szermer; Piotr Zając; Piotr Amrozik; Cezary Maj; Jacek Nazdrowicz; Grzegorz Jabłoński; Bartosz Sakowicz
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Performance Comparison of Native and Hybrid Android Mobile Applications Based on Sensor Data-Driven Applications Based on Bluetooth Low Energy (BLE) and Wi-Fi Communication Architecture

Energies
2022-06-23 | Journal article
Contributors: Aleksander Kaczmarczyk; Piotr Zając; Wojciech Zabierowski
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

A capacitive 3-axis mems accelerometer for medipost: A portable system dedicated to monitoring imbalance disorders

Sensors
2021 | Journal article
EID:

2-s2.0-85106196071

Part of ISSN: 14248220
Contributors: Szermer, M.; Zając, P.; Amrozik, P.; Maj, C.; Jankowski, M.; Jabłoński, G.; Kiełbik, R.; Nazdrowicz, J.; Napieralska, M.; Sakowicz, B.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier
grade
Preferred source (of 3)‎

Comparison of cooling performance of manifold and straight microchannel heat sinks using CFD simulation

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
2021 | Conference paper
EID:

2-s2.0-85105603855

Contributors: Zajac, P.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier
grade
Preferred source (of 2)‎

Thermal Performance of a Capacitive Comb-Drive MEMS Accelerometer: Measurements vs. Simulation

Energies
2021-11-09 | Journal article
Contributors: Mariusz Jankowski; Piotr Zając; Piotr Amrozik; Michał Szermer; Cezary Maj; Grzegorz Jabłoński; Jacek Nazdrowicz
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Fundamentals of the Thermal Analysis of Complex Arrangements of Underground Heat Sources

Energies
2021-10-18 | Journal article
Contributors: Heiner Brakelmann; George J. Anders; Piotr Zajac
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

CMOS Interface for Capacitive Sensors with Custom Fully-Differential Amplifiers

Proceedings of 27th International Conference on Mixed Design of Integrated Circuits and Systems, MIXDES 2020
2020 | Conference paper
EID:

2-s2.0-85091705034

Contributors: Jankowski, M.; Zajac, P.; Amrozik, P.; Szermer, M.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Compact Thermal Modelling Tool for Fast Design Space Exploration of 3D ICs with Integrated Microchannels

Energies
2020-05 | Journal article | Author
Contributors: Piotr Zajac
Source: check_circle
Multidisciplinary Digital Publishing Institute
grade
Preferred source (of 3)‎

Analytical modelling of MEMS Z-axis comb-drive accelerometer

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
2019 | Conference paper
EID:

2-s2.0-85067492615

Contributors: Maj, C.; Szermer, M.; Zajac, P.; Amrozik, P.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Application of Offset Trimming Circuit for Reducing the Impact of Parasitics in Capacitive Sensor Readout Circuit

Proceedings of the 26th International Conference "Mixed Design of Integrated Circuits and Systems", MIXDES 2019
2019 | Conference paper
EID:

2-s2.0-85071315528

Contributors: Zajac, P.; Jankowski, M.; Amrozik, P.; Szermer, M.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Coupled electro-mechanical simulation of capacitive MEMS accelerometer for determining optimal parameters of readout circuit

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
2019 | Conference paper
EID:

2-s2.0-85067501702

Contributors: Zajac, P.; Szermer, M.; Amrozik, P.; Maj, C.; Jablonski, G.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Manufacturing and Characterization of Test Structures Dedicated for the Investigation of Heat Transfer Processes at Nanoscale

THERMINIC 2019 - 2019 25th International Workshop Thermal Investigations of ICs and Systems
2019 | Conference paper
EID:

2-s2.0-85078049291

Contributors: Topilko, J.; Sobczak, A.; Pietrzak, P.; Zajac, P.; Janicki, M.; Janus, P.; Zubert, M.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Measurement and simulation of test structures dedicated to the investigation of heat diffusion at nanoscale

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
2019 | Conference paper
EID:

2-s2.0-85067514593

Contributors: Janicki, M.; Topilko, J.; Sobczak, A.; Zajac, P.; Pietrzak, P.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

TIMiTIC: A C++ based Compact Thermal Simulator for 3D ICs with Microchannel Cooling

THERMINIC 2019 - 2019 25th International Workshop Thermal Investigations of ICs and Systems
2019 | Conference paper
EID:

2-s2.0-85078004768

Contributors: Zajac, P.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Assessment of Different Methodologies for the Estimation of DPL Model Parameter Values for Dynamic Thermal Simulations of Nanoscale Electronic Structures

THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
2018 | Conference paper
EID:

2-s2.0-85061491037

Contributors: Zubert, M.; Janicki, M.; Zajac, P.; Raszkowski, T.; Topilko, J.; Pietrzak, P.; Jablonski, G.; Samson, A.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Fully differential read-out circuitry components for MEMS-based accelerometers

2018 14th International Conference on Perspective Technologies and Methods in MEMS Design, MEMSTECH 2018 - Proceedings
2018 | Conference paper
EID:

2-s2.0-85048420829

Contributors: Jankowski, M.; Zajac, P.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Influence of geometry scaling on comb-drive accelerometer performance

2018 14th International Conference on Perspective Technologies and Methods in MEMS Design, MEMSTECH 2018 - Proceedings
2018 | Conference paper
EID:

2-s2.0-85048409136

Contributors: Szermer, M.; Zajac, P.; Starzak, L.; Zabierowski, W.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Measurement and Modeling of Heat Conduction in MEMS Nanostructures

Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
2018 | Conference paper
EID:

2-s2.0-85051073396

Contributors: Janicki, M.; Janus, P.; Pietrzak, P.; Zajac, P.; Jablonski, G.; Sobczak, A.; Topiłko, J.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Measurement and simulation of MEMS dedicated to investigation of heat transfer at nanoscale

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
2018 | Conference paper
EID:

2-s2.0-85048857114

Contributors: Janicki, M.; Pietrzak, P.; Topilko, J.; Zajac, P.; Sobczak, A.; Jablonski, G.; Janus, P.; Prokaryn, P.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Methodology of determining the applicability range of the DPL model to heat transfer in modern integrated circuits comprised of FinFETs

Microelectronics Reliability
2018 | Journal article
EID:

2-s2.0-85052919677

Part of ISSN: 00262714
Contributors: Zubert, M.; Raszkowski, T.; Samson, A.; Zając, P.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Novel thermal model of microchannel cooling system designed for fast simulation of liquid-cooled ICs

Microelectronics Reliability
2018 | Journal article
EID:

2-s2.0-85049300661

Part of ISSN: 00262714
Contributors: Zając, P.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

On the applicability of single-layer integrated microchannel cooling in 3D ICs

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
2018 | Conference paper
EID:

2-s2.0-85048873723

Contributors: Zajac, P.; Janicki, M.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Comparative analysis of compact thermal models generated from measured thermal responses and detailed thermal models

Proceedings of the 24th International Conference on Mixed Design of Integrated Circuits and Systems, MIXDES 2017
2017 | Conference paper
EID:

2-s2.0-85030242126

Contributors: Raszkowski, T.; Samson, A.; Torzewicz, T.; Zając, P.; Janicki, M.; Zubert, M.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Comparative Analysis of Compact Thermal Models Generated from Measured Thermal Responses and. Detailed Thermal Models

Proceedings of the 24th International Conference Mixed Design of Integrated Circuits and Systems - Mixdes 2017
2017 | Journal article
WOSUID:

WOS:000426980600065

Contributors: Raszkowski, Tomasz; Samson, Agnieszka; Torzewicz, Tomasz; Zajac, Piotr; Janicki, Marcin; Zubert, Mariusz; Napieralski, Andrzej
Source: Self-asserted source
Piotr Zajac via ResearcherID

Novel method for fast FEM simulation of chips with integrated microchannel cooling

THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems
2017 | Conference paper
EID:

2-s2.0-85045839570

Contributors: Zajac, P.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Peak temperature reduction by optimizing power density distribution in 3D ICs with microchannel cooling

Microelectronics Reliability
2017 | Journal article
WOSUID:

WOS:000417774400059

Contributors: Zajgac, Piotr; Maj, Cezary; Napieralski, Andrzej
Source: Self-asserted source
Piotr Zajac via ResearcherID
grade
Preferred source (of 2)‎

Positioning of thermal via regions for reducing hotspot temperature in 3D ICs

Advanced Materials - TechConnect Briefs 2017
2017 | Conference paper
EID:

2-s2.0-85029295074

Contributors: Maj, C.; Galicia, M.; Zajac, P.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

The scope of applicability of DPL model to the heat transfer in electronic devices and integrated circuits

THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems
2017 | Conference paper
EID:

2-s2.0-85045832323

Contributors: Zubert, M.; Raszkowski, T.; Samson, A.; Janicki, M.; Zajac, P.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

The use of mobile technology on the example of health and sports statistics application

2017 13th International Conference Perspective Technologies and Methods in MEMS Design, MEMSTECH 2017 - Proceedings
2017 | Conference paper
EID:

2-s2.0-85025638060

Contributors: Berentowicz, M.; Zając, P.; Zabierowski, W.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

The Use of Mobile Technology on the Example of Health and Sports Statistics Application

2017 Xiiith International Conference on Perspective Technologies and Methods in Mems Design (Memstech)
2017 | Journal article
WOSUID:

WOS:000414280700046

Contributors: Berentowicz, Michal; Zajac, Piotr; Zabierowski, Wojciech; IEEE
Source: Self-asserted source
Piotr Zajac via ResearcherID

Thermal coupling phenomenon in ICs cooled by integrated microchannels

Proceedings of the 24th International Conference on Mixed Design of Integrated Circuits and Systems, MIXDES 2017
2017 | Conference paper
EID:

2-s2.0-85030242237

Contributors: Zając, P.; Maj, C.; Zabierowski, W.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Thermal Coupling Phenomenon in ICs Cooled by Integrated Microchannels

Proceedings of the 24th International Conference Mixed Design of Integrated Circuits and Systems - Mixdes 2017
2017 | Journal article
WOSUID:

WOS:000426980600071

Contributors: Zajac, Piotr; Maj, Cezary; Zabierowski, Wojciech; Napieralski, Andrzej
Source: Self-asserted source
Piotr Zajac via ResearcherID

Time constant spectra based fitting of thermal model parameters

THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems
2017 | Conference paper
EID:

2-s2.0-85045837987

Contributors: Raszkowski, T.; Samson, A.; Torzewicz, T.; Zajac, P.; Sobczak, A.; Janicki, M.; Zubert, M.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Analysis of the impact of power distribution on the efficiency of microchannel cooling in 3D ICs

THERMINIC 2016 - 22nd International Workshop on Thermal Investigations of ICs and Systems
2016 | Conference paper
EID:

2-s2.0-85006918597

Contributors: Zajac, P.; Maj, C.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Analysis of the Impact of Power Distribution on the Efficiency of Microchannel Cooling in 3D ICs

2016 22nd International Workshop on Thermal Investigations of Ics and Systems (Therminic)
2016 | Journal article
WOSUID:

WOS:000390754600014

Contributors: Zajac, Piotr; Maj, Cezary; Napieralski, Andrzej; IEEE
Source: Self-asserted source
Piotr Zajac via ResearcherID

Analytical modelling of bossed membrane

Perspective Technologies and Methods in MEMS Design, MEMSTECH 2016 - Proceedings of 12th International Conference
2016 | Conference paper
EID:

2-s2.0-84981277885

Contributors: Maj, C.; Zajac, P.; Szermer, M.; Melnyk, M.; Napieralski, A.; Lobur, M.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Analytical Modelling of Bossed Membrane

2016 XII International Conference on Perspective Technologies and Methods in MEMS Design (MEMSTECH)
2016 | Journal article
WOSUID:

WOS:000389271200003

Contributors: Maj, Cezary; Zajac, Piotr; Szermer, Michal; Melnyk, Mykhaylo; Napieralski, Andrzej; Lobur, Mykhaylo; IEEE
Source: Self-asserted source
Piotr Zajac via ResearcherID

Coupled thermo-fluidic simulation for design space exploration of microchannels in liquid-cooled 3D ICs

Proceedings of the 23rd International Conference Mixed Design of Integrated Circuits and Systems, MIXDES 2016
2016 | Conference paper
EID:

2-s2.0-84992035579

Contributors: Zajac, P.; Maj, C.; Galicia, M.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Coupled Thermo-fluidic Simulation for Design Space Exploration of Microchannels in Liquid-cooled 3D ICs

Proceedings of the 23rd International Conference on Mixed Design of Integrated Circuits and Systems (Mixdes 2016)
2016 | Journal article
WOSUID:

WOS:000383221700048

Contributors: Zajac, Piotr; Maj, Cezary; Galicia, Melvin; Napieralski, Andrzej
Source: Self-asserted source
Piotr Zajac via ResearcherID

DPL based electro-thermal modelling of Fin-FET transistors

Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
2016 | Conference paper
EID:

2-s2.0-84983339960

Contributors: Raszkowski, T.; Zubert, M.; Zajac, P.; Nowak, P.S.; Janicki, M.; Samson, A.; Galicia, M.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

DPL Based Electro-Thermal Modelling of Fin-FET Transistors

2016 15th Ieee Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm)
2016 | Book chapter
WOSUID:

WOS:000390436000149

Contributors: Raszkowski, T.; Zubert, M.; Zajac, P.; Nowak, P. S.; Janicki, M.; Samson, A.; Galicia, M.; Napieralski, A.; IEEE
Source: Self-asserted source
Piotr Zajac via ResearcherID

Impact of floorplanning and thermal vias placement on temperature in 2D and 3D processors

Microelectronics Journal
2016 | Journal article
WOSUID:

WOS:000377726100005

Contributors: Zajac, Piotr; Galicia, Melvin; Maj, Cezary; Napieralski, Andrzej
Source: Self-asserted source
Piotr Zajac via ResearcherID
grade
Preferred source (of 2)‎

Analytical modeling of membrane bending in range of large deflections

Perspective Technologies and Methods in MEMS Design, MEMSTECH 2015 - Proceedings of 11th International Conference
2015 | Conference paper
EID:

2-s2.0-84959861225

Contributors: Maj, C.; Zajac, P.; Szermer, M.; Zabierowski, W.; Melnyk, M.; Napieralski, A.; Lobur, M.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Analytical Modeling of Membrane Bending in Range of Large Deflections

2015 Xi International Conference on Perspective Technologies and Methods in Mems Design (Memstech)
2015 | Journal article
WOSUID:

WOS:000380444000002

Contributors: Maj, Cezary; Zajac, Piotr; Szermer, Michal; Zabierowski, Wojciech; Melnyk, Mykhaylo; Napieralski, Andrzej; Lobur, Mykhaylo; IEEE
Source: Self-asserted source
Piotr Zajac via ResearcherID

Applying the golden section search in optimization of micro actuator design

Proceedings of 13th International Conference: The Experience of Designing and Application of CAD Systems in Microelectronics, CADSM 2015
2015 | Conference paper
EID:

2-s2.0-84961721973

Contributors: Melnyk, M.R.; Kernytskyy, A.B.; Lobur, M.V.; Zajac, P.; Szermer, M.; Maj, C.; Zabierowski, W.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Applying the Golden Section Search in Optimization of Micro actuator Design

Proceedings of Xiiith International Conference - Experience of Designing and Application of Cad Systems in Microelectronics Cadsm 2015
2015 | Journal article
WOSUID:

WOS:000380570000013

Contributors: Melnyk, M. R.; Kernytskyy, A. B.; Lobur, M. V.; Zajac, P.; Szermer, M.; Maj, C.; Zabierowski, W.; Napieralski, A.; IEEE
Source: Self-asserted source
Piotr Zajac via ResearcherID

Characterization of thermal vias for 3D ICs using FEM analysis

THERMINIC 2015 - 21st International Workshop on Thermal Investigations of ICs and Systems
2015 | Conference paper
EID:

2-s2.0-84966263999

Contributors: Galicia, M.; Zajac, P.; Maj, C.; Napieralski, A.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier

Characterization of Thermal Vias for 3D ICs Using FEM Analysis

2015 21st International Workshop on Thermal Investigations of Ics and Systems (Therminic)
2015 | Journal article
WOSUID:

WOS:000380401600023

Contributors: Galicia, Melvin; Zajac, Piotr; Maj, Cezary; Napieralski, Andrzej; IEEE
Source: Self-asserted source
Piotr Zajac via ResearcherID

Custom method for automation of microbolometer design and simulation

Proceedings of the 22nd International Conference Mixed Design of Integrated Circuits and Systems, MIXDES 2015
2015 | Conference paper
EID:

2-s2.0-84953776525

Contributors: Melnyk, M.; Kernytskyy, A.; Lobur, M.; Szermer, M.; Zajac, P.; Maj, C.; Zabierowski, W.
Source: Self-asserted source
Piotr Zajac via Scopus - Elsevier
Items per page:
Page 1 of 2

Peer review (18 reviews for 8 publications/grants)

Review activity for Batteries. (1)
Review activity for Case studies in thermal engineering. (1)
Review activity for Electrochem. (2)
Review activity for Electronics. (1)
Review activity for Energies. (7)
Review activity for IEEE access : (4)
Review activity for IET circuits, devices & systems. (1)
Review activity for Micromachines. (1)