Personal information
Activities
Works (10)
Sensors
2023
|
Journal article
EID:
2-s2.0-85153969971
Contributors:
Bajwa, R.;
Yapici, M.K.
Source:
Rayan Bajwa
via
Scopus - Elsevier
Microsystems and Nanoengineering
2023
|
Journal article
EID:
2-s2.0-85161301864
Contributors:
Bajwa, R.;
Saleh, H.;
Shojaeian, M.;
Tekin, I.;
Yapici, M.K.
Source:
Rayan Bajwa
via
Scopus - Elsevier
Journal of Microelectromechanical Systems
2023
|
Journal article
EID:
2-s2.0-85159848340
Contributors:
Bajwa, R.;
Yapici, M.K.
Source:
Rayan Bajwa
via
Scopus - Elsevier
grade
Preferred source
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2)
2023 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2023
2023
|
Conference paper
EID:
2-s2.0-85175246460
Contributors:
Shafaghi, A.H.;
Abdul, B.;
Bajwa, R.;
Irani, F.S.;
Kaya Yapici, M.
Source:
Rayan Bajwa
via
Scopus - Elsevier
Microelectronics Reliability
2022
|
Journal article
EID:
2-s2.0-85134602356
Contributors:
Saleh, H.;
Shojaeian, M.;
Bajwa, R.;
Tekin, I.;
Yapici, M.K.
Source:
Rayan Bajwa
via
Scopus - Elsevier
Proceedings - 2021 16th International Conference on Design and Technology of Integrated Systems in Nanoscale Era, DTIS 2021
2021
|
Conference paper
EID:
2-s2.0-85125633176
Contributors:
Saleh, H.;
Bajwa, R.;
Tekin, I.;
Yapici, M.K.
Source:
Rayan Bajwa
via
Scopus - Elsevier
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020
2020
|
Conference paper
EID:
2-s2.0-85090416745
Contributors:
Saleh, H.;
Bajwa, R.;
Tekin, I.;
Yapici, M.K.
Source:
Rayan Bajwa
via
Scopus - Elsevier
Sensors (Switzerland)
2019
|
Journal article
EID:
2-s2.0-85071281168
Contributors:
Bajwa, R.;
Yapici, M.K.
Source:
Rayan Bajwa
via
Scopus - Elsevier
Journal of Micromechanics and Microengineering
2019
|
Journal article
EID:
2-s2.0-85067569316
Contributors:
Bajwa, R.;
Yapici, M.K.
Source:
Rayan Bajwa
via
Scopus - Elsevier
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
2018
|
Conference paper
EID:
2-s2.0-85048882941
Contributors:
Bajwa, R.;
Yapici, M.K.
Source:
Rayan Bajwa
via
Scopus - Elsevier