Personal information
Verified email addresses
hetongfu@buaa.edu.cn
hetongfubuaa@163.com
hetongfu@ouc.edu.cn
Activities
Employment (1)
2021-07-04
to
present
|
Postdoctoral Researcher
(College of Engineering)
Employment
Source:
Tongfu He
Education and qualifications (3)
2016-09-05
to
2021-06-05
|
Doctor of Philosophy
(School of Instrumentation Science and OptoElectronics Engineering)
Education
Source:
Tongfu He
2012-09-06
to
2015-03-30
|
Master of science
(School of Instrumentation Science and OptoElectronics Engineering)
Education
Source:
Tongfu He
2008-09-05
to
2012-06-30
|
Bachelor of Science
(School of Control Science and Engineering)
Education
Source:
Tongfu He
Works (16)
Aerospace Science and Technology
2022-07
|
Journal article
Contributors:
Tongfu He;
Zhong Wu
Source:
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Crossref
IEEE Robotics and Automation Letters
2022-07
|
Journal article
Contributors:
Tingting Guo;
Xiuyan Liu;
Tongfu He;
Dalei Song
Source:
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Crossref
Journal of Vibration and Control
2022-02
|
Journal article
Contributors:
Tongfu He;
Zhong Wu
Source:
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Crossref
IEEE/CAA Journal of Automatica Sinica
2021
|
Journal article
EID:
2-s2.0-85105105175
Contributors:
He, T.;
Wu, Z.
Source:
Tongfu He
via
Scopus - Elsevier
Aerospace Science and Technology
2020-01
|
Journal article
Contributors:
Tongfu He;
Zhong Wu
Source:
Tongfu He
via
Crossref Metadata Search
IEEE Access
2019
|
Journal article
Contributors:
Tongfu He;
Zhong Wu
Source:
check_circle
Crossref
Journal of Magnetism and Magnetic Materials
2017
|
Journal article
EID:
2-s2.0-85002406572
Contributors:
Zhang, Y.;
Wang, S.-S.;
Hu, T.;
He, T.-F.;
Chen, Z.-Y.;
Yi, Z.;
Meng, L.-F.
Source:
Tongfu He
via
Scopus - Elsevier
2017-04-12
|
Patent
Source:
Tongfu He
Physica C: Superconductivity and its Applications
2016
|
Journal article
EID:
2-s2.0-84975454828
Contributors:
Chen, D.-X.;
He, T.-F.;
Zhang, M.-J.;
Wang, S.-S.;
Shi, Y.-H.;
Cardwell, D.A.
Source:
Tongfu He
via
Scopus - Elsevier
2016-09-07
|
Patent
Source:
Tongfu He
IEEE Transactions on Applied Superconductivity
2014
|
Journal article
EID:
2-s2.0-84959420036
Contributors:
Wang, S.;
He, T.;
Zhang, Y.
Source:
Tongfu He
via
Scopus - Elsevier
Cryo. & Supercond.
2014-12-09
|
Journal article
Source:
Tongfu He
Cryo. & Supercond.
2014-09-02
|
Journal article
Source:
Tongfu He
2014-08-24
|
Patent
Source:
Tongfu He
Applied Mechanics and Materials
2013
|
Book
EID:
2-s2.0-84887441461
Contributors:
Wang, S.S.;
Ning, X.S.;
He, T.F.
Source:
Tongfu He
via
Scopus - Elsevier
2013 IEEE International Conference on Applied Superconductivity and Electromagnetic Devices, ASEMD 2013
2013
|
Conference paper
EID:
2-s2.0-84899087901
Contributors:
Wang, S.S.;
Chen, Z.Y.;
Zhang, Y.M.;
He, T.F.
Source:
Tongfu He
via
Scopus - Elsevier