Personal information

Other IDs

Scopus Author ID: 56033043400

Keywords

Electronic Packaging, Nanomaterials, cleanroom processing

Countries

United States

Activities

Collapse all

Employment (4)

Yale University: New Haven, Connecticut, US

2022-01-04 to present | Postdoctoral Associate (Neurosurgery Department)
Employment
Source: Self-asserted source
Yue Gu

Tianshui Huatian Technology Co. Ltd: Tianshui, Gansu Province, CN

2014-08-26 to 2014-09-05 | Internship (Progress and Production)
Employment
Source: Self-asserted source
Yue Gu

Tianshui Huatian Technology Co. Ltd: Tianshui, Gansu Province, CN

2013-08-21 to 2013-09-03 | Internship (Production)
Employment
Source: Self-asserted source
Yue Gu

ASESH: Shang Hai, Shang Hai, CN

2011-07-02 to 2011-09-02
Employment
Source: Self-asserted source
Yue Gu

Education and qualifications (4)

American Chemical Society: Washington D.C., DC, US

ACS Reviewer Lab Certificate of Completion (ACS Reviewer Lab)
Education
Source: check_circle
American Chemical Society Reviewers Lab

University of California, San Diego: San Diego, CA, US

2015-09-17 to 2021-10-07 | PhD (NanoEngineering)
Education
Source: Self-asserted source
Yue Gu

Beijing Institute of Technology: Beijing, Beijing, CN

2012-09-10 to 2015-03-30 | Master (School of Materials Science and Engineering)
Education
Source: Self-asserted source
Yue Gu

Beijing Institute of Technology: Beijing, Beijing, CN

2008-08-28 to 2012-06-21 | Bachelor (Materials Science and Engineering)
Education
Source: Self-asserted source
Yue Gu

Works (23)

Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions

Materials
2024-04-04 | Journal article
DOI: 10.3390/ma17071658
Contributors: Yexing Fang; Taiyu Wang; Yue Gu; Mingkun Yang; Hong Li; Sujun Shi; Xiuchen Zhao; Yongjun Huo
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Advanced Electronic Packaging Technology: From Hard to Soft

Materials
2023-03-15 | Journal article
DOI: 10.3390/ma16062346
Contributors: Yue Gu; Yongjun Huo
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Three-dimensional transistor arrays for intra- and inter-cellular recording

Nature Nanotechnology
2021-12-23 | Journal article
DOI: 10.1038/s41565-021-01040-w
Part of ISSN: 1748-3387
Part of ISSN: 1748-3395
Source: Self-asserted source
Yue Gu

Continuous monitoring of deep-tissue haemodynamics with stretchable ultrasonic phased arrays

Nature Biomedical Engineering
2021-07-16 | Journal article
DOI: 10.1038/s41551-021-00763-4
Contributors: Chonghe Wang; Baiyan Qi; Muyang Lin; Zhuorui Zhang; Mitsutoshi Makihata; Boyu Liu; Sai Zhou; Yi-hsi Huang; Hongjie Hu; Yue Gu et al.
Source: check_circle
Crossref

A fabrication process for flexible single-crystal perovskite devices

Nature
2020-07 | Journal article
DOI: 10.1038/s41586-020-2526-z
Part of ISSN: 0028-0836
Part of ISSN: 1476-4687
Source: Self-asserted source
Yue Gu

Comparative study on the hourglass-like joint of electroplated Sn-base solder reinforced by adding Ag3Sn nanoparticles and Ag micro-alloying elements

Materialia
2020-03 | Journal article
DOI: 10.1016/j.mtla.2019.100558
Part of ISSN: 2589-1529
Source: Self-asserted source
Yue Gu

Strain engineering and epitaxial stabilization of halide perovskites

Nature
2020-01 | Journal article
DOI: 10.1038/s41586-019-1868-x
Part of ISSN: 0028-0836
Part of ISSN: 1476-4687
Source: Self-asserted source
Yue Gu

Biomembrane-Modified Field Effect Transistors for Sensitive and Quantitative Detection of Biological Toxins and Pathogens

ACS Nano
2019 | Journal article
DOI: 10.1021/acsnano.9b00911
EID:

2-s2.0-85062847468
Contributors: Gong, H.; Chen, F.; Huang, Z.; Gu, Y.; Zhang, Q.; Chen, Y.; Zhang, Y.; Zhuang, J.; Cho, Y.-K.; Fang, R.H. et al.
Source: Self-asserted source
Yue Gu via Scopus - Elsevier

Wearable thermoelectrics for personalized thermoregulation

Science Advances
2019-05-03 | Journal article
DOI: 10.1126/sciadv.aaw0536
Contributors: Sahngki Hong; Yue Gu; Joon Kyo Seo; Joseph Wang; Ping Liu; Y. Shirley Meng; Sheng Xu; Renkun Chen
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Controlled Homoepitaxial Growth of Hybrid Perovskites

Advanced Materials
2018 | Journal article
DOI: 10.1002/adma.201705992
EID:

2-s2.0-85044746812
Contributors: Lei, Y.; Chen, Y.; Gu, Y.; Wang, C.; Huang, Z.; Qian, H.; Nie, J.; Hollett, G.; Choi, W.; Yu, Y. et al.
Source: Self-asserted source
Yue Gu via Scopus - Elsevier

Monitoring of the central blood pressure waveform via a conformal ultrasonic device

Nature Biomedical Engineering
2018 | Journal article
DOI: 10.1038/s41551-018-0287-x
EID:

2-s2.0-85053264474
Contributors: Wang, C.; Li, X.; Hu, H.; Zhang, L.; Huang, Z.; Lin, M.; Zhang, Z.; Yin, Z.; Huang, B.; Gong, H. et al.
Source: Self-asserted source
Yue Gu via Scopus - Elsevier

Stretchable ultrasonic transducer arrays for three-dimensional imaging on complex surfaces

Science Advances
2018 | Journal article
DOI: 10.1126/sciadv.aar3979
EID:

2-s2.0-85044464020
Contributors: Hu, H.; Zhu, X.; Wang, C.; Zhang, L.; Li, X.; Lee, S.; Huang, Z.; Chen, R.; Chen, Z.; Wang, C. et al.
Source: Self-asserted source
Yue Gu via Scopus - Elsevier

Three-dimensional integrated stretchable electronics

Nature Electronics
2018 | Journal article
DOI: 10.1038/s41928-018-0116-y
EID:

2-s2.0-85056234200
Contributors: Huang, Z.; Hao, Y.; Li, Y.; Hu, H.; Wang, C.; Nomoto, A.; Pan, T.; Gu, Y.; Chen, Y.; Zhang, T. et al.
Source: Self-asserted source
Yue Gu via Scopus - Elsevier

Facile, Large-Scale, and Expeditious Synthesis of Hollow Co and Co@Fe Nanostructures: Application for Electromagnetic Wave Absorption

The Journal of Physical Chemistry C
2017 | Journal article
DOI: 10.1021/acs.jpcc.6b11284
ARXIV:

http://dx.doi.org/10.1021/acs.jpcc.6b11284

Source: Self-asserted source
Yue Gu
grade
Preferred source (of 2)‎

Merging of Thin- and Thick-Film Fabrication Technologies: Toward Soft Stretchable “Island–Bridge” Devices

Advanced Materials Technologies
2017 | Journal article
DOI: 10.1002/admt.201600284
Source: Self-asserted source
Yue Gu
grade
Preferred source (of 2)‎

Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO2 nanoparticles

Journal of Alloys and Compounds
2017 | Journal article
DOI: https://doi.org/10.1016/j.jallcom.2016.12.037
Source: Self-asserted source
Yue Gu
grade
Preferred source (of 2)‎

Soft, stretchable, high power density electronic skin-based biofuel cells for scavenging energy from human sweat

Energy Environ. Sci.
2017 | Journal article
DOI: 10.1039/C7EE00865A
Source: Self-asserted source
Yue Gu
grade
Preferred source (of 2)‎

Effect of Ag addition on growth of the interfacial intermetallic compounds between Sn-0.7Cu solder and Cu substrate

Materials Science Forum
2015 | Book
DOI: 10.4028/www.scientific.net/MSF.815.129
EID:

2-s2.0-84928662270
Contributors: Xie, X.C.; Zhao, X.C.; Liu, Y.; Cheng, J.W.; Zheng, B.; Gu, Y.
Source: Self-asserted source
Yue Gu via Scopus - Elsevier

Effects of cobalt nanoparticles addition on shear strength, wettability and interfacial intermetallic growth of Sn−3.0Ag−0.5Cu solder during thermal cycling

Materials Science Forum
2015 | Book
DOI: 10.4028/www.scientific.net/MSF.815.97
EID:

2-s2.0-84928662100
Contributors: Gu, Y.; Liu, Y.; Zhao, X.C.; Wen, S.L.; Li, H.; Wang, Y.
Source: Self-asserted source
Yue Gu via Scopus - Elsevier

Enhancement of mean-time-to-failure of Sn3.0Ag0.5Cu solder bump joint under current stressing via controlling bump shape

Journal of Materials Science: Materials in Electronics
2015 | Journal article
DOI: 10.1007/s10854-014-2633-4
EID:

2-s2.0-84925534073
Contributors: Chen, P.; Zhao, X.; Wang, Y.; Liu, Y.; Li, H.; Gu, Y.
Source: Self-asserted source
Yue Gu via Scopus - Elsevier

Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder

Journal of Materials Science: Materials in Electronics
2015-05-07 | Journal article
DOI:

10.1007/s10854-015-3151-8
Source: Self-asserted source
Yue Gu
grade
Preferred source (of 2)‎

Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn-Ag-Cu solders on Cu substrates

Journal of Alloys and Compounds
2014 | Journal article
DOI:

http://dx.doi.org/10.1016/j.jallcom.2014.12.024
Source: Self-asserted source
Yue Gu
grade
Preferred source (of 2)‎

Preparation and Tribological Properties of Dual‐Coated TiO2 Nanoparticles as Water‐Based Lubricant Additives

Journal of Nanomaterials
2014-01 | Journal article
DOI: 10.1155/2014/785680
Contributors: Yue Gu; Xiuchen Zhao; Ying Liu; Yunxia Lv; Qi Ding
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Peer review (4 reviews for 3 publications/grants)

Review activity for ACS biomaterials science & engineering. (1)
Review activity for Advanced materials interfaces. (1)
Review activity for Microsystems & nanoengineering. (2)
How many people are using ORCID?