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Works (14)

Super-resolution imaging of linearized chromatin in tunable nanochannels

Nanoscale Horizons
2023 | Journal article
DOI: 10.1039/D3NH00096F
Contributors: Ji-Hoon Lee; Joyce Han-Ching Chiu; Nicholas J. Ginga; Tasdiq Ahmed; M. D. Thouless; Yifan Liu; Shuichi Takayama
Source: check_circle
Crossref

Magnetic Force-Based Measurement Technique to Investigate the Effect of Lead-Free Solder Intermetallic Compounds (IMC) on Interconnect Reliability

2023-05 | Conference paper
DOI: 10.1109/ECTC51909.2023.00057
Contributors: Nicholas J. Ginga; Rui Chen; Suresh K. Sitaraman
Source: check_circle
Crossref

Cohesive fracture measurement technique for free-hanging thin films using highly stressed superlayer

Thin Solid Films
2022-09 | Journal article
DOI: 10.1016/j.tsf.2022.139379
Contributors: Nicholas J. Ginga; Suresh K. Sitaraman
Source: check_circle
Crossref

Thermomechanical Reliability Investigation of Carbon Nanotube Off-Chip Interconnects for Electronic Packages

IEEE Transactions on Components, Packaging and Manufacturing Technology
2022-08 | Journal article
DOI: 10.1109/TCPMT.2022.3194163
Contributors: Nicholas J. Ginga; Suresh K. Sitaraman
Source: check_circle
Crossref

Magnetic-Based Interfacial Adhesion Measurement Technique with Environmental Conditions

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
2022-05 | Conference paper
DOI: 10.1109/ectc51906.2022.00254
Contributors: Rui Chen; Nicholas J. Ginga; Suresh K. Sitaraman
Source: Self-asserted source
Nicholas Ginga

High-force, precise, and bidirectional uniaxial stretcher for real-time imaging of normally closed h-PDMS crack-valves for femto-liter fluid delivery

Microfluidics and Nanofluidics
2022-04 | Journal article
DOI: 10.1007/s10404-022-02533-3
Contributors: Nicholas J. Ginga; Joyce Han-Ching Chiu; Ji-Hoon Lee; M. D. Thouless; Shuichi Takayama
Source: check_circle
Crossref

Magnetically Actuated Test Method for Interfacial Fracture Reliability Assessment

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
2021-06 | Conference paper
DOI: 10.1109/ectc32696.2021.00138
Contributors: Rui Chen; Nicholas J. Ginga; Suresh K. Sitaraman
Source: Self-asserted source
Nicholas Ginga

Biaxial Inflation Stretch Test for Printed Electronics

2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
2020-06 | Conference paper
DOI: 10.1109/ectc32862.2020.00178
Contributors: Benjamin G. Stewart; Nicholas J. Ginga; Suresh K. Sitaraman
Source: Self-asserted source
Nicholas Ginga

Waviness reduces effective modulus of carbon nanotube forests by several orders of magnitude

Carbon
2014-01 | Journal article
DOI: 10.1016/j.carbon.2013.08.042
Part of ISSN: 0008-6223
Contributors: Nicholas J. Ginga; Wei Chen; Suresh K. Sitaraman
Source: Self-asserted source
Nicholas Ginga

The experimental measurement of effective compressive modulus of carbon nanotube forests and the nature of deformation

Carbon
2013-03 | Journal article
DOI: 10.1016/j.carbon.2012.10.054
Part of ISSN: 0008-6223
Contributors: Nicholas J. Ginga; Suresh K. Sitaraman
Source: Self-asserted source
Nicholas Ginga

New Method to Measure Tensile Strength of Low Modulus Thin Films

International Journal of Fracture
2011-08 | Journal article
DOI: 10.1007/s10704-011-9610-1
Part of ISSN: 0376-9429
Part of ISSN: 1573-2673
Contributors: Nicholas J. Ginga; Suresh K. Sitaraman
Source: Self-asserted source
Nicholas Ginga

Silicon and Nanoscale Metal Interface Characterization Using Stress-Engineered Superlayer Test Methods

IEEE Transactions on Components and Packaging Technologies
2009-06 | Journal article
DOI: 10.1109/tcapt.2009.2021699
Part of ISSN: 1521-3331
Contributors: Jiantao Zheng; Mitul Modi; Nicholas Ginga; Suresh Sitaraman
Source: Self-asserted source
Nicholas Ginga

Microcontact Spring Reliability: Design Against Interfacial Fracture

IEEE Transactions on Components and Packaging Technologies
2009-03 | Journal article
DOI: 10.1109/tcapt.2008.2010131
Part of ISSN: 1521-3331
Part of ISSN: 1557-9972
Contributors: M.B. Modi; N. Ginga; S.K. Sitaraman
Source: Self-asserted source
Nicholas Ginga

Silicon, Low-K Dielectric, and Nano-Scale Metal Interface Characterization Using Stress-Engineered Superlayer Test Methods

2007 Proceedings 57th Electronic Components and Technology Conference
2007 | Conference paper
DOI: 10.1109/ectc.2007.373975
Contributors: Jiantao Zheng; Mitul Modi; Nicholas Ginga; Suresh Sitaraman
Source: Self-asserted source
Nicholas Ginga

Peer review (1 review for 1 publication/grant)

Review activity for Analytical chemistry. (1)
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