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Works (11)

Optimal Molecular Dynamics System Size for Increased Precision and Efficiency for Epoxy Materials

The Journal of Physical Chemistry B
2024-05-02 | Journal article
Contributors: Khatereh Kashmari; Sagar U. Patil; Josh Kemppainen; Gowtham Shankara; Gregory M. Odegard
Source: check_circle
Crossref

Multiscale Process Modeling of Semicrystalline PEEK for Tailored Thermomechanical Properties

ACS Applied Engineering Materials
2023-11-24 | Journal article
Contributors: Khatereh Kashmari; Hashim Al Mahmud; Sagar U. Patil; William A. Pisani; Prathamesh Deshpande; Marianna Maiaru; Gregory M. Odegard
Source: check_circle
Crossref

A Multiscale Approach to Investigate the Effect of Temperature and Crystallinity on the Development of Residual Stresses in Semicrystalline PEEK

Proceedings of the American Society for Composites - 37th Technical Conference, ASC 2022
2022 | Conference paper
EID:

2-s2.0-85139566684

Contributors: Kashmari, K.; Deshpande, P.; Patil, S.; Maiaru, M.; Odegard, G.M.
Source: Self-asserted source
Khatereh Kashmari via Scopus - Elsevier

Molecular modeling of PEEK resins for prediction of properties in process modeling

Earth and Space 2021: Materials, Structures, Dynamics, and Control in Extreme Environments - Selected Papers from the 17th Biennial International Conference on Engineering, Science, Construction, and Operations in Challenging Environments
2021 | Conference paper
EID:

2-s2.0-85104856233

Contributors: Kashmari, K.; Patil, S.; Deshpande, P.; Shah, S.; Maiaru, M.; Odegard, G.M.
Source: Self-asserted source
Khatereh Kashmari via Scopus - Elsevier

Prediction of PEEK resin properties for processing modeling using molecular dynamics

36th Technical Conference of the American Society for Composites 2021: Composites Ingenuity Taking on Challenges in Environment-Energy-Economy, ASC 2021
2021 | Conference paper
EID:

2-s2.0-85120482175

Contributors: Kashmari, K.; Deshpande, P.; Patil, S.; Shah, S.; Maiaru, M.; Odegard, G.M.
Source: Self-asserted source
Khatereh Kashmari via Scopus - Elsevier

Multi-scale approach to predict cure-induced residual stresses in an epoxy system

Proceedings of the American Society for Composites - 35th Technical Conference, ASC 2020
2020 | Conference paper
EID:

2-s2.0-85097283059

Contributors: Patil, S.; Shah, S.; Deshpande, P.; Kashmari, K.; Olaya, M.; Odegard, G.; Maiarù, M.
Source: Self-asserted source
Khatereh Kashmari via Scopus - Elsevier

Multiscale modeling for virtual manufacturing of thermoset composites

AIAA Scitech 2020 Forum
2020 | Conference paper
EID:

2-s2.0-85091954698

Contributors: Shah, S.; Patil, S.; Deshpande, P.; Krieg, A.; Kashmari, K.; Mahmud, H.A.; King, J.A.; Odegard, G.M.; Maiaru, M.
Source: Self-asserted source
Khatereh Kashmari via Scopus - Elsevier

Multiscale modelling of the cure process in thermoset polymers using ICME

Proceedings of the American Society for Composites - 35th Technical Conference, ASC 2020
2020 | Conference paper
EID:

2-s2.0-85097262448

Contributors: Deshpande, P.P.; Shah, S.; Patil, S.; Kashmari, K.; Olaya, M.; Odegard, G.M.; Maiarù, M.
Source: Self-asserted source
Khatereh Kashmari via Scopus - Elsevier

A multi-scale approach for modelling the cure of thermoset polymers within ICME

Proceedings of the American Society for Composites - 34th Technical Conference, ASC 2019
2019 | Conference paper
EID:

2-s2.0-85088405082

Contributors: Deshpande, P.P.; Shah, S.; Patil, S.; Kashmari, K.; Odegard, G.M.; Maiaru, M.
Source: Self-asserted source
Khatereh Kashmari via Scopus - Elsevier

Multiscale modeling of thermoset composite to predict process-induced residual stresses

ICCM International Conferences on Composite Materials
2019 | Conference paper
EID:

2-s2.0-85097349690

Contributors: Shah, S.; Patil, S.; Deshpande, P.; Kashmari, K.; Odegard, G.M.; Maiarù, M.
Source: Self-asserted source
Khatereh Kashmari via Scopus - Elsevier

Prediction of residual stress build-up in polymer matrix composite during cure using a two-scale approach

Proceedings of the American Society for Composites - 34th Technical Conference, ASC 2019
2019 | Conference paper
EID:

2-s2.0-85088771747

Contributors: Patil, S.; Shah, S.; Deshpande, P.; Kashmari, K.; Odegard, G.; Maiarù, M.
Source: Self-asserted source
Khatereh Kashmari via Scopus - Elsevier

Peer review (4 reviews for 1 publication/grant)

Review activity for Proceedings of the Institution of Mechanical Engineers. (4)